发明名称 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
摘要 <P>PROBLEM TO BE SOLVED: To enable an efficient and automatic test using an optical tester even if a back is subjected to mirror finishing. <P>SOLUTION: In a semiconductor device having a surface on which an outer connection electrode is formed and a mirror-like back 10(#a) opposed to the surface, a roughened area 14 is provided in a part of the back 10(#a) by a laser marking method. The roughened area 14 includes a production data mark 14(#a) of the semiconductor device itself which is printed using the laser marking method. Moreover, the roughened area 14 determines the number, size, geometry, and disposition place of the roughened area 14 in a degree that the product data are read based on difference in light reflectivity between the roughened area 14 and the mirrored area 12 when light is irradiated on the back 10(#a). <P>COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005203695(A) 申请公布日期 2005.07.28
申请号 JP20040010688 申请日期 2004.01.19
申请人 CASIO MICRONICS CO LTD 发明人 NAYA KINICHI
分类号 H01L23/00;B23K26/00;H01L21/02;H01L21/301;H01L21/56;H01L21/60;H01L21/68;H01L23/544;H01L29/423 主分类号 H01L23/00
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