| 摘要 |
PROBLEM TO BE SOLVED: To easily manufacture a configuration with stable high reliability even during operation of a device using an optical element mounting substrate such as a laser beam emission device. SOLUTION: The substrates of a two-layer structure are used, a through hole is provided on one substrate, and the other substrate surface is made a mounting face of an optical component. Furthermore, a reference marker is provided on a wafer previously provided with an optical component mounting positioning marker, and highly precise positioning joint of a wafer level is performed on the basis thereof. COPYRIGHT: (C)2005,JPO&NCIPI
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