发明名称 METAL CONTACT STRUCTURE AND MANUFACTURING METHOD THEREOF
摘要 PROBLEM TO BE SOLVED: To provide a metal contact structure, and a method for manufacturing the metal contact structure. SOLUTION: A metal contact passes through an interlayer dielectric for electrically connected to a metal structure, such as a metal gate electrode 112 in a transistor. A conductive layer 140 is provided between a metal layer 150 and the metal gate 112. The conductive layer provides at least one barrier layer, a bonding layer, or an etching stop layer. The conductive layer is made of an element metal, a metal alloy, a metal nitride, and a metal oxide, or their combination. And the conductive layer may be formed of polysilicon. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005203773(A) 申请公布日期 2005.07.28
申请号 JP20050000626 申请日期 2005.01.05
申请人 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD 发明人 LIN CHUN-CHIEH;KO CHIH-HSIN;LEE WEN-CHIN
分类号 H01L21/336;H01L21/768;H01L21/8234;H01L23/485;H01L27/092;H01L27/10;H01L29/78;H01L29/786;(IPC1-7):H01L21/768 主分类号 H01L21/336
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