Substrate bonding method in manufacturing of LCD used in notebook computer, involves moving robot fingers of loader, having absorption pads to adsorb substrate, into bonding chamber

摘要

The robot fingers of loader, having absorption pads to adsorb substrate (10), is moved into a bonding chamber. Several adsorption pins are brought into contact with substrate to adsorb the substrate. The fingers are moved out of the chamber, to load the substrate on lower stage (240). A substrate (20) is loaded on upper stage (230) in chamber. The stages are moved close to each other so as to bond the substrates. Independent claims are also included for the following: (1) loader; (2) stage; (3) method for loading substrate; and (4) apparatus for bonding substrates.