| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a light emitting diode element which assures sufficient electrode-to-electrode distance when the size is reduced and ensures uniform luminance by enhancing the yield of scribing of an element and providing a flip chip light emitting diode element in the reduced size, and also to provide a method of manufacturing a light emitting diode which can enhance manufacturing yield and amount of production. <P>SOLUTION: A substrate and a light emitting diode have the water-caltrop type contours, electrodes thereof are located at both ends of the diagonal line of the longer side in the water-caltrop shape, and accordingly, the electrode distance becomes longer and the light emitting area becomes large. This light emitting diode is fixed to the substrate with the flip chip package system. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
