| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic device in which a chip is mounted on a mounting board by face-down bonding, wherein the adhesion of a seal resin onto the bump or the main face of the chip is prevented. SOLUTION: The electronic device is constituted by having a chip 11 formed with a specific conductive pattern on the main face 11a of an element board, a mounting board 13 in which the chip 11 is mounted by the face-down bonding through a bump 12, the frame-like member 14 of a heat shrinkability which is closely adhered to this chip 11 to enclose the chip 11, and comes into contact with the mounting face of the mounting board 13, and a resin 15 which is mounted on the mounting board 13 over the chip 11 and the frame-like member 14 without coming into contact with a bump 12 and the main face 11a, and hermetically seals the chip 11 to fix the chip 11 and the frame-like member 14 to the mounting board 13. COPYRIGHT: (C)2005,JPO&NCIPI |
