发明名称 |
Semiconductor device and manufacturing method of them |
摘要 |
A semiconductor device which can meet the requirement for a further increase in pins, which multi-functionalization and faster operation would entail is to be provided. Bonding pads and bonding pads are arranged in a zigzag pattern in a direction along an outer circumference of a main surface of a chip. To focus on power supply-line bonding pads among all the bonding pads, an odd number of bonding pads are to be arranged in a direction of the outer circumference of the main surface between adjoining bonding pads. A greater width is secured for the power supply-line bonding pads than for other bonding pads, and a diameter of wires to be connected to the power supply-line bonding pads is set greater than that of other wires.
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申请公布号 |
US2005162880(A1) |
申请公布日期 |
2005.07.28 |
申请号 |
US20040005217 |
申请日期 |
2004.12.07 |
申请人 |
RENESAS TECHNOLOGY CORP. |
发明人 |
MIYAKI YOSHINORI;SUZUKI KAZUNARI;OHASHI HIROHITO |
分类号 |
H01L23/12;G11C5/02;H01L21/60;H01L21/8238;H01L23/495;H01L23/498;H01L23/50;H01L23/66;H01L27/118;(IPC1-7):G11C5/02 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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