发明名称 |
METHOD OF AND APPARATUS FOR PROTECTING THIN COPPER FOIL AND OTHER SHINY SUBSTRATES DURING HANDLING AND RIGOROUS PROCESSING, AS PCB MANUFACTURE AND THE LIKE, BY ELECTRIC-CHARGE ADHERENCE THERETO OF THIN RELEASE-LAYERED PLASTIC FILMS AND THE LIKE, AND IMPROVED PRODUCTS PRODUCED THEREBY |
摘要 |
An improved method of and apparatus for producing preferably thin plastic protective film layers for thin shiny copper foils and the like, as for PCB applications, with electric-charge adhering of the same to the foil and with peel-off releasable properties to provide the same original pristine, shiny copper foil surface without contamination, marring or other physical, chemical or other residue despite handling and other processing procedures.
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申请公布号 |
US6921451(B2) |
申请公布日期 |
2005.07.26 |
申请号 |
US20020186866 |
申请日期 |
2002.06.28 |
申请人 |
METALLIZED PRODUCTS, INC. |
发明人 |
WILHEIM MARTIN J. |
分类号 |
B29C63/00;B32B7/06;B32B15/08;H05K3/02;(IPC1-7):B32B31/12 |
主分类号 |
B29C63/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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