发明名称 Method for testing a remnant batch of semiconductor devices
摘要 A method for testing semiconductor devices includes loading a customer tray with semiconductor devices to be tested. Groups of devices are transferred from the customer tray to buffer trays for testing. The number of devices in the customer tray is checked after each transfer. If the customer tray is empty, the number of semiconductor devices in the buffer trays is counted and compared with the number of semiconductor devices that can be tested simultaneously, typically either 64 or 128. If the number of semiconductor devices in the buffer trays is greater than the tester capacity, the semiconductor devices in at least one buffer tray are tested. If the number of semiconductor devices in the buffer trays is smaller than the tester capacity, semiconductor devices that were determined to be low quality in a prior test are loaded into a buffer tray, thus testing both untested and low quality devices together.
申请公布号 US6922050(B2) 申请公布日期 2005.07.26
申请号 US20040835143 申请日期 2004.04.28
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 CHUNG AE-YONG;KIM SUNG-OK;BANG JEONG-HO;SHIN KYEONG-SEON;CHI DAE-GAB
分类号 G01R31/26;G01R31/01;(IPC1-7):G01R31/02 主分类号 G01R31/26
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