发明名称 |
System and method for quantifying uniformity patterns for tool development and monitoring |
摘要 |
A system and method of determining multiple uniformity metrics of a semiconductor wafer includes quantitatively defining a location metric of a nonuniformity on the surface of the wafer. A quantity is measured at multiple locations on a top surface of the wafer and a center of mass is of the nonuniformity is determined.
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申请公布号 |
US6922603(B1) |
申请公布日期 |
2005.07.26 |
申请号 |
US20020327233 |
申请日期 |
2002.12.20 |
申请人 |
LAM RESEARCH CORPORATION |
发明人 |
BAILEY III ANDREW D. |
分类号 |
G06F19/00;H01L21/66;(IPC1-7):G06F19/00 |
主分类号 |
G06F19/00 |
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