发明名称 |
DIE, AND FORMING METHOD USING DIE |
摘要 |
PROBLEM TO BE SOLVED: To provide a die and a forming method using the die in which at least any one of reduction of the friction force at a part to reduce the friction force and retention of the friction force at a part to require the friction force is easily and reliably performed in the relative operation of the local friction force applied between the die and a work. SOLUTION: A lower die has an oscillation providing mechanism 6 including an oscillator 15 and a control means 16, and the oscillation is provided to a part of the lower die 3 close to or facing a work 2. COPYRIGHT: (C)2005,JPO&NCIPI
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申请公布号 |
JP2005193293(A) |
申请公布日期 |
2005.07.21 |
申请号 |
JP20040004494 |
申请日期 |
2004.01.09 |
申请人 |
KAWASAKI HEAVY IND LTD |
发明人 |
ARAKI TOSHIMITSU;KAWANO SEISHIROU;KIMURA TAKESHI |
分类号 |
B21D22/20;B21D24/00;(IPC1-7):B21D22/20 |
主分类号 |
B21D22/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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