| 摘要 |
A cooling arrangement for a printed circuit board with a heat-dissipating electronic element comprises a radiating layer ( 108, 208, 308 ) on the top side of the PCB ( 100, 200, 300 ) and a covering ( 103, 203, 303 ) for thermally connecting the top side of the heat-dissipating electronic element ( 101, 201, 301 ) and the radiating layer ( 108, 208, 308 ), wherein the heat-dissipating electronic element is mounted on the bottom side of the PCB and the PCB is mounted horizontally. The covering can be made of a good heat conductor, e.g. copper, while the bottom side of the covering can be protected by a heat-insulating layer ( 105, 205, 305 ). The covering can have plain ( 104 A, 204 A) or notched ( 104 B, 204 B) arms.
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