| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent dislocation of a semiconductor chip mounted on a semiconductor module without controlling the position of the semiconductor chip. <P>SOLUTION: In the semiconductor module, the semiconductor chip is stored in a cavity formed in a substrate, and the semiconductor chip is fixed to a die pad at a bottom of the cavity. The die pad in the size of the mounted semiconductor chip is formed at the bottom of the cavity, where the semiconductor chip is stored. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
