发明名称 CONDUCTIVE PASTE AND CERAMIC ELECTRONIC PART
摘要 PROBLEM TO BE SOLVED: To provide a conductive paste with which ceramic electronic components do not couple with each other, and yet can be easily separated from each other even after being combined, due to a roughened surface of an outer electrode film. SOLUTION: Metal powder as a conductive component of the conductive paste is at least structured of mixture powder of spherical metal powder, scaly metal powder and dendroid metal powder. To this powder, an organic solvent and organic resin are added to make up the conductive paste. The metal powder is formed of either base metal or precious metal. Preferably, a particle size of the spherical metal powder is 0.3 to 3μm, that of the scaly metal powder, 1 to 20μm, and that of the dendroid metal powder, 5 to 20μm. Thus, the ceramic electronic components with the outer electrode film formed with the use of at least the scaly metal powder are provided. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005197039(A) 申请公布日期 2005.07.21
申请号 JP20040000733 申请日期 2004.01.06
申请人 DAIKEN KAGAKU KOGYO KK 发明人 DAITO KENJI;SEKI NOBUYUKI;HARADA AKIO
分类号 H01G4/12;H01B1/22;H01B5/00;(IPC1-7):H01B1/22 主分类号 H01G4/12
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