Handling a dielectric substrate and electrically conducting mask, comprises applying the mask to the substrate and holding it in place electrostatically or magnetically

摘要

Process for handling a dielectric substrate (3) and an electrically conducting mask (4), comprises applying the mask to the substrate. The mask is held in place by electrostatic or magnetic force produced by the substrate holder (2). The latter is located on a support surface (2'). The mask holder (1) is located under the upper carrier.