发明名称 MANUFACTURING METHOD OF LAMINATED SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a manufacturing method of a laminated substrate with which inspection man-hour can be reduced and which has an inspection procedure without overlooking of a failure in a manufacturing process of a laminated electronic component. SOLUTION: The method has a conductor pattern printing process for applying conductor patterns in a plurality of blocks in vertical and lateral directions on the surface of a substrate sheet. For inspecting the substrate sheet in which through holes are punched, a characteristic value on punching of all the blocks is inspected by sampling every other ceramic sheets in an arranging order for the prescribed number of laminated unit layers, and sampling of every other sheets is varied at every laminated single layer in the arranging order. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005197402(A) 申请公布日期 2005.07.21
申请号 JP20040001032 申请日期 2004.01.06
申请人 HITACHI METALS LTD 发明人 WAI SHINICHI;SOMETSUGU TAKAHIRO
分类号 H05K3/00;H01L23/12;H05K3/46;(IPC1-7):H05K3/46 主分类号 H05K3/00
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