发明名称 ELECTRONIC COMPONENT HOUSING CASE AND IMAGE DISPLAY APPARATUS PROVIDED THEREWITH
摘要 PROBLEM TO BE SOLVED: To provide an electronic component housing case capable of smoothly radiating heat generated from an electronic component housed in the case to the outside, and an image display apparatus provided therewith. SOLUTION: The electronic component housing case for housing the electronic component generating heat therein is provided with one or more partition walls 120 for partially partitioning the space of the case. Inflow portions 113, 115 each of which air flows in, and discharge portions 114, 116 in each of which the air flowing from the inflow portions absorbs and discharges the heat from the electronic component such as an image display panel 3 and circuit boards 4, 5, 6 and 7 are formed on each surface defining the space partitioned by the partition wall 120. This image display apparatus 101 is provided with the electronic component containing case. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005197766(A) 申请公布日期 2005.07.21
申请号 JP20030182684 申请日期 2003.06.26
申请人 SAMSUNG SDI CO LTD 发明人 RYU HO-CHUL;BAE SUNG-WON
分类号 G02F1/1333;G02F1/13;G02F1/133;G06F1/16;G06F1/20;G09F9/00;H01L23/34;H04N5/64;H04N5/645;H05K5/02;H05K7/20;(IPC1-7):H04N5/64 主分类号 G02F1/1333
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