POLISHING PAD FOR CMP AND POLISHING METHOD USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a polishing pad for CMP with which in-plane uniformity after polishing of a workpiece is sufficiently realized.

SOLUTION: The polishing pad for CMP 1 is formed of hard foaming polyurethane, and has an inner region 2 whose polishing face is circular, and an outer region 3 in a doughnut shape which surrounds the inner region. Bubble density of the inner region 2 is larger than that of the outer region 3. Asker D hardness of the outer region 3 and that of the inner region 2 are 45 to 70, and a hardness difference of them is three or less.

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