| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a high sensitivity dry film resist. <P>SOLUTION: The dry film resist is obtained by stacking at least one resist layer and a protective layer in this order on a support, wherein at least one layer of the resist layer is a resist layer of 1-15 μm thickness comprising a water-dispersible photopolymerizable resin composition including an aqueous binder dispersion, an organic-solvent-soluble photopolymerization initiator, a polyfunctional monomer and an organic solvent, wherein the organic solvent is at least one selected from the group consisting of alkoxyalkyl esters and ketones. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
