发明名称 |
Thermal interface material and solder preforms |
摘要 |
A solder preform having multiple layers including a solder layer filled with additives interposed between two unfilled layers for improved wettability. A solder preform having a sphere which contains a solder material filled with additives, and an unfilled surface layer for improved wettability. A thermal interface material having a bonding component and an additive component which is a CTE modifying component and/or a thermal conductivity enhancement component. Active solders containing intrinsic oxygen getters. |
申请公布号 |
AU2003291827(A1) |
申请公布日期 |
2005.07.21 |
申请号 |
AU20030291827 |
申请日期 |
2003.11.25 |
申请人 |
FRY'S METALS, INC. |
发明人 |
BRIAN LEWIS;BAWA SINGH;JOHN P. LAUGHLIN;DAVID V. KYAW;ANTHONY INGHAM |
分类号 |
B23K35/24;B23K35/14;B23K35/30;B23K35/36;C22C5/02;C22C28/00;H01L23/373;H01L23/42;H01L23/48 |
主分类号 |
B23K35/24 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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