发明名称 LASER PROCESSING METHOD AND DEVICE
摘要 Displacement of a laser beam concentration point is reduced as much as possible, and simultaneously, laser processing is efficiently performed. A laser processing method has displacement acquiring steps (S07-S11). In the steps, a distance measuring laser beam for measuring the displacement of a surface (S1) of an object (S) to be processed is collected by a lens and irradiated to the object (S), and the displacement of a surface along a planned cutting line is acquired while the beam reflected by a main surface in correspondence to the irradiation is being detected (45). While the distance between an objective lens (42) for processing and the surface (S1) is being adjusted based on the displacement acquired in the displacement acquiring steps, the objective lens (42) for processing and the object (S) to be processed are relatively moved along the main surface to form a reformed region along the planned cutting line (P).
申请公布号 WO2005065880(A1) 申请公布日期 2005.07.21
申请号 WO2004JP18591 申请日期 2004.12.13
申请人 HAMAMATSU PHOTONICS K.K.;ATSUMI, KAZUHIRO;KUNO, KOJI;KUSUNOKI, MASAYOSHI;SUZUKI, TATSUYA 发明人 ATSUMI, KAZUHIRO;KUNO, KOJI;KUSUNOKI, MASAYOSHI;SUZUKI, TATSUYA
分类号 B23K26/00;B23K26/02;B23K26/03;B23K26/04;B23K26/38;B23K26/40 主分类号 B23K26/00
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