发明名称 Laser processing method and processing device
摘要 Laser beam is irradiated to a surface of a processing target after reforming a cross section of the laser beam with a mask having a pierced hole by concentrating the laser beam passing through the pierced hole by a lens to foreman image of the pierced hole of the mask on the surface of the processing target. The laser beam passing through the lens is scanned to move an irradiating position of the laser beam on the surface of the processing target, and the image of the pierced hole of the mask is formed on the surface of the processing target during the scanning for processing the processing target. A high quality laser process can be carried out.
申请公布号 US2005155956(A1) 申请公布日期 2005.07.21
申请号 US20050065589 申请日期 2005.02.25
申请人 SUMITOMO HEAVY INDUSTRIES, LTD. 发明人 HAMADA SHIRO;YAMAMOTO JIRO;YAMAGUCHI TOMOYUKI
分类号 B23K26/06;B23K26/08;B23K26/38;(IPC1-7):B23K26/38 主分类号 B23K26/06
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