INSPECTION DEVICE AND METHOD FOR MANUFACTURING THE SAME, METHOD FOR MANUFACTURING ELECTRO-OPTIC DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

摘要

An inspection device includes a substrate; a stress relieving layer that is provided on the substrate; a contact that is provided on the stress relieving layer; and a wiring pattern that is electrically connected to the contact. Furthermore, method for manufacturing an inspection device includes the steps of: providing a substrate; forming a stress relieving layer on a surface of the substrate; forming a wiring pattern extending over the stress relieving layer on the surface of the substrate; and forming a contact on the wiring pattern in an area above the stress relieving layer.