ELECTRONIC DEVICE

摘要

An electronic device having an interposer substrate of MCM structure, or the like, in which heat dissipation performance is enhanced while sustaining connection reliability between the interposer substrate and a mother board. A metal core substrate having high thermal capacity and thermal conductivity is employed as both interposer substrate and mother board. At least one of the interposer substrate and the mother board is provided with a core metal exposing part. A pad for direct solder joint is formed at the core metal exposing part in order to solder-join the interposer substrate and the mother board.