发明名称 |
FORMING A COPPER DIFFUSION BARRIER |
摘要 |
<p>Noble metal may be used as a non-oxidizing diffusion barrier (20, 32) to prevent diffusion from copper lines (22a, b). A diffusion barrier may be formed of a noble metal formed over an adhesion promoting layer (18) or by a noble metal cap over an oxidizable diffusion barrier (30). The copper lines may also be covered with a noble metal.</p> |
申请公布号 |
KR20050074977(A) |
申请公布日期 |
2005.07.19 |
申请号 |
KR20057007676 |
申请日期 |
2005.04.29 |
申请人 |
INTEL CORP. |
发明人 |
JOHNSTON STEVEN;DUBIN VALERY;MCSWINEY MICHAEL;MOON PETER |
分类号 |
H01L21/285;H01L21/288;H01L21/768;H01L23/532;(IPC1-7):H01L21/768 |
主分类号 |
H01L21/285 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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