| 发明名称 |
PROCESS AND APPARATUS FOR THE TREATMENT OF A WAFER AS WELL AS WAFERS WITH AN INTERLAYER AND CARRIER LAYER |
| 摘要 |
The invention relates to a method and a device for machining wafers, in particular for thinning wafers. The invention also relates to a wafer comprising a support layer and a separation layer that is situated between the support layer and the wafer. Said separation layer is a plasma polymer layer, which adheres to the wafer and adheres to the support layer more strongly than to the wafer. |
| 申请公布号 |
KR20050075037(A) |
申请公布日期 |
2005.07.19 |
| 申请号 |
KR20057009751 |
申请日期 |
2003.11.28 |
| 申请人 |
FRAUNHOFER-GESELLSCHAFT ZUR FORDERUNG DER ANGEWANDTEN FORSCHUNG E.V.;JAKOB ANDREAS |
发明人 |
JAKOB ANDREAS;VISSING KLAUS D.;STENZEL VOLKMAR |
| 分类号 |
H01L21/78;(IPC1-7):H01L21/78 |
主分类号 |
H01L21/78 |
| 代理机构 |
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