发明名称 RESIN COMPOSITION AND PHASE CHANGE TYPE HEAT-CONDUCTIVE MEMBER
摘要 PROBLEM TO BE SOLVED: To provide a phase change type heat radiation member which has adhesiveness and can also easily be softened/fluidized at the operation temperatures of electronic parts, and to provide a resin composition suitable for producing the same. SOLUTION: This resin composition comprises (A) a thermoplastic resin having a Vicat softening temperature or a ring and ball method softening point of 15 to 200°C measured according to JIS-K7206, (B) a softening agent, (C) heat-conductive inorganic powder, (D) a fatty acid ester, and (E) at least one tackifier selected from aliphatic petroleum resins, alicyclic petroleum resins, aromatic petroleum resins, aliphatic component-aromatic component copolymer petroleum resins, rosin ester resins, modified rosin ester resins, terpene resins, aromatic modified terpene resins, and terpene-phenol resins. The phase change type heat-conductive member comprises the molded article of the resin composition. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005187567(A) 申请公布日期 2005.07.14
申请号 JP20030428782 申请日期 2003.12.25
申请人 DENKI KAGAKU KOGYO KK 发明人 FUKAZAWA MOTOHARU;YAMAGATA TOSHITAKA;OTSUKI SHINJI;CHIBA TAKASHI
分类号 C09K5/06;C08K3/00;C08K5/01;C08K5/101;C08L101/12;C09K5/08;H01L23/36 主分类号 C09K5/06
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