发明名称 |
RADIATION-EMITTING AND/OR RADIATION-RECEIVING SEMICONDUCTOR COMPONENT AND METHOD FOR THE PRODUCTION THEREOF |
摘要 |
The invention relates to a radiation-emitting and/or radiation-receiving semiconductor component comprising a radiation-emitting and/or radiation-receiving semiconductor chip, a plastic molded part, which is permeable to an electromagnetic radiation to be emitted and/or received by the semiconductor component and by means of which the semiconductor chip is at least partially deformed. The semiconductor component also comprises external electrical connections electrically connected to electrical contact surfaces of the semiconductor chip. The plastic molded part is made of a reaction-hardening silicon molding material. The invention also relates to a method for producing a semiconductor component of the aforementioned type. |
申请公布号 |
WO2005064696(A1) |
申请公布日期 |
2005.07.14 |
申请号 |
WO2004DE02738 |
申请日期 |
2004.12.14 |
申请人 |
OSRAM OPTO SEMICONDUCTORS GMBH;BRUNNER, HERBERT;JAEGER, HARALD;SORG, JOERG ERICH |
发明人 |
BRUNNER, HERBERT;JAEGER, HARALD;SORG, JOERG ERICH |
分类号 |
H01L31/0203;H01L31/18;H01L33/48;H01L33/50;H01L33/56;H01L33/62;(IPC1-7):H01L33/00;H01L31/020 |
主分类号 |
H01L31/0203 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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