发明名称 ELECTROLYTIC ETCHING METHOD AND APPARATUS
摘要 <p><P>PROBLEM TO BE SOLVED: To solve the problem that, regarding a method and apparatus for performing partial etching and pattern etching using electrolytic reaction, heretofore, an etching line can not be finely formed at the end part of a cell due to the problem of alignment precision in the apparatus, and to provide a method and apparatus where fine wire etching is possible, and the line can be formed at the end part of the cell. <P>SOLUTION: The electrolytic etching method for a substrate 105 in which the layer to be etched is formed on the surface comprises: a stage wherein the working part 111 of a working electrode 101 is arranged at the side more outwardly than the end face of the substrate 105 with a fixed gap provided from the end face of the substrate; and a stage wherein electric current is passed between the substrate 105 and the working electrode 101. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p>
申请公布号 JP2005187938(A) 申请公布日期 2005.07.14
申请号 JP20040321641 申请日期 2004.11.05
申请人 CANON INC 发明人 TSUZUKI KOJI;MURAKAMI TSUTOMU
分类号 C25F3/02;B23H3/00;B23H3/04;B23H5/00;C25F3/14;C25F7/00;H01L21/3063;H01L31/042;H01L31/18;(IPC1-7):C25F3/02;H01L21/306 主分类号 C25F3/02
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