| 摘要 |
PROBLEM TO BE SOLVED: To easily form a plating film having a flatter surface by compactly and uniformly depositing a plating film in a wiring groove or a micropore with priority in accordance with mechanical and electrochemical means without being influenced by the variation in the shape of the wiring groove or micropore. SOLUTION: In the plating method, at the time of burying a wiring material into a fine recessed part for wiring provided at the surface of a substrate by electroplating, as a plating liquid is filled between an anode and the surface of the substrate arranged so as to be confronted with the anode, electric current is made to flow between the anode and the surface of the substrate so as to perform first plating treatment; and, as a plating liquid is filled between the anode and the surface of the substrate arranged so as to be confronted with the anode, a porous body is arranged, and, while repeating the contact/non-contact between the porous body and the surface of the substrate, at the time when the porous body is contacted with the surface of the substrate, electric current is made to flow between the anode and the surface of the substrate so as to perform second plating treatment to the surface of the substrate. COPYRIGHT: (C)2005,JPO&NCIPI
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