| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device that deals with more pins for more functions and faster speed. <P>SOLUTION: A bonding pad 9 and a bonding pad 10 are alternately arranged in a direction along the periphery of a chip's main surface. When power supply bonding pads 9 are taken note of from among the bonding pads 9; an odd number of bonding pads are arranged between adjacent bonding pads 9 in a direction along the periphery of the chip's main surface, the width of the power supply bonding pad 9 is securely made wider than that of other bonding pads, and the diameter of wires 11 and 12 contacting the power supply bonding pad 9 is made larger than that of other wires 13 and 14. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
