发明名称 |
Process for producing substrate for flexible circuit board |
摘要 |
The invention provides a process for producing a substrate for flexible circuit boards which comprises: providing a multilayered insulating resin layer comprising an insulating layer and an adhesive layer; and laminating a metal foil to the insulating layer of the multilayered insulating resin layer via the adhesive layer at a temperature not lower than the glass transition temperature of the insulating layer.
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申请公布号 |
US2005150595(A1) |
申请公布日期 |
2005.07.14 |
申请号 |
US20040006698 |
申请日期 |
2004.12.08 |
申请人 |
NITTO DENKO CORPORATION |
发明人 |
JO KYOUYUU;MIYAKE YASUFUMI |
分类号 |
B32B15/08;B32B37/12;H05K1/00;H05K1/03;H05K3/02;H05K3/38;(IPC1-7):B32B31/00 |
主分类号 |
B32B15/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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