发明名称 |
CHIP TYPE SOLID ELECTROLYTIC CAPACITOR HAVING PLATED FILLET SURFACE AND METHOD OF MANUFACTURING THE SAME |
摘要 |
In a chip type solid electrolytic capacitor, an anode terminal is provided with an anode terminal lower surface exposed from a package lower surface and an anode terminal end surface adjacent to the anode terminal lower surface and exposed from a first package end surface. The cathode terminal is also provided with a cathode terminal lower surface and a cathode terminal end surface. The anode terminal end surface is provided with an anode terminal dent surface upwardly extending from the boundary with the anode terminal lower surface. The anode terminal dent surface is plated. The cathode terminal end surface is also provided with a cathode terminal dent surface which is plated. |
申请公布号 |
KR20050072664(A) |
申请公布日期 |
2005.07.12 |
申请号 |
KR20040116447 |
申请日期 |
2004.12.30 |
申请人 |
NEC TOKIN CORPORATION;NEC TOKIN TOYAMA, LTD. |
发明人 |
ABE SATOSHI;ISHIJIMA MASAMI |
分类号 |
H01G9/004;H01G2/06;H01G4/228;H01G9/00;H01G9/012;H01G9/04;H01G9/042;H01G9/10;H01G9/15;(IPC1-7):H01G9/15 |
主分类号 |
H01G9/004 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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