发明名称 |
Multi-barrel die transfer apparatus and method for transferring dies therewith |
摘要 |
A method and system for transferring a plurality of integrated circuit dies from a first surface to a second surface is described. Each hollow barrel of a plurality of hollow barrels is applied to a respective die residing on the first surface. The respective die is caused to move into each hollow barrel in parallel. These steps are repeated until each hollow barrel contains a stack of dies of a predetermined number. A die from each hollow barrel is deposited onto the second surface until the stack of dies contained by each hollow barrel is substantially depleted.
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申请公布号 |
US6915551(B2) |
申请公布日期 |
2005.07.12 |
申请号 |
US20020322718 |
申请日期 |
2002.12.19 |
申请人 |
MATRICS, INC. |
发明人 |
ARNESON MICHAEL R.;BANDY WILLIAM R. |
分类号 |
G06K19/077;H01L21/56;H01L21/68;H01L23/498;(IPC1-7):B23P25/00;B23P19/00;H01Q13/00 |
主分类号 |
G06K19/077 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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