| 摘要 |
A surface-mounted SAW device designed to form an airtight space below an IDT electrode on the lower surface of an SAW chip by coating the outer surface of the SAW chip with heated and softened sheet resin and by filling resin into the bottom of the SAW chip, wherein a negative-pressure suction via a through-hole formed in a mounting substrate and a stricter profile management of a heating temperature and a suction, conventionally needed to ensure a sufficient amount of resin to be filled into a gap, can be eliminated. A production method for the surface-mounted SAW device comprising the step of flip- chip-mounting an SAW chip on a mounting substrate, the laminate step of pressing a resin sheet from one end of the mounting substrate toward the other end while softening or melting the resin sheet to cover the outer surface of the SAW chip with resin while the airtight space is being kept intact, the press forming step of heating under pressure the SAW chip to cure the resin with the expansion of a gas in the airtight space restricted, and the post-curing step of heating the press-formed SAW device at a temperature and for a time duration that ensure the complete curing of the resin, wherein the thickness tr of the resin sheet before the laminate step satisfies the relation, L/[(X+Gx)(Y+Gy)] <= tr. |
