BONDING DEVICE AND METHOD

摘要

A device and method for bonding objects to be bonded each having a metal bonding portion on a base, comprising cleaning means for exposing the metal bonding portions to a plasma having an energy enough to etch the surface of the metal bonding portions to a depth of 1.6 nm over the entire surfaces of the metal bonding portions under a reduced pressure and bonding means for bonding the metal bonding portions of the objects taken out of the cleaning means in the air. By using a specific scheme, metal bonding portions after the plasma cleaning can be bonded in the air, thereby significantly simplifying the bonding step and the whole device and lowering the cost.