POLYAMIDE ACID RESIN CONTAINING UNSATURATED GROUP, PHOTOSENTIVE RESIN COMPOSITION USING SAME, AND CURED PRODUCT THEREOF

摘要

Disclosed is a novel polyamide acid resin (A) containing an unsaturated grou p which is suitable for a photosensitive resin composition. Also disclosed is a photosensitive resin composition using such a polyamide acid resin which is excellent in photosensitivity. A cured product of such a photosensitive resi n composition is excellent in flexibility as well as in adhesiveness, pencil hardness, solvent resistance, acid resistance, heat resistance, gold plating resistance and the like. The polyamide acid resin (A) containing an unsaturated group is obtained by reacting a polyester resin (a) containing a n unsaturated group wherein an anhydride group is at the end and a compound (b ) having two amino groups in a molecule. The photosensitive resin composition contains such a polyamide acid resin (A) containing an unsaturated group, a crosslinking agent (B) and a photopolymerization initiator (C).