发明名称 |
Wafer-level electronic module, has monolithic substrate with redistribution structure for providing connector contact coupled to integrated circuit dice, where structure provides electronic device coupled to circuit dice |
摘要 |
<p>The module has a monolithic substrate (801) with a redistribution structure (510`) for providing a connector contact coupled to integrated circuit dice. The redistribution structure provides a passive electronic device (810) e.g. an inductor, electrically coupled to the circuit dice. The structure has a conductive layer to provide electrical connection to a contact pad of the electronic device mounted on the substrate. Independent claims are also included for the following: (A) a method of fabricating an electronic module (B) an article of manufacture having an electronic module.</p> |
申请公布号 |
DE102004049249(A1) |
申请公布日期 |
2005.07.07 |
申请号 |
DE20041049249 |
申请日期 |
2004.09.30 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
BAEK, SEUNG-DUK;JANG, DONG-HYEON;KIM, GU-SUNG;LEE, KANG-WOOK;CHUNG, JAE-SIK |
分类号 |
H01L25/18;H01L21/768;H01L21/82;H01L23/50;H01L25/04;H01L27/02;(IPC1-7):H01L23/50 |
主分类号 |
H01L25/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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