Resin cover application to a system wafer, comprises applying a cover to a carrier via a connection layer, and then mechanically removing the carrier and connection layer

摘要

A process for applying resin covers (3) to a system wafer (5) with active components (8), comprises using a carrier (7). The wafer and carrier are prepared, and the cover is applied to the carrier via connection layer (6). The carrier is located on the wafer, afterwhich the carrier and the connection layer are removed mechanically. The semiconductor chips are then separated out. The carrier is flexible.