| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a package for housing a light emitting element which has high radiation intensity and excellent optical characteristics, such as illuminance, color rendering properties, etc. and to provide a light emitting device. <P>SOLUTION: The package for housing the light emitting element includes a substrate 1 having the mounting part 1a of the light emitting element 5 at the central part of the upper surface, a frame-like reflecting member 2 provided to surround the mounting part 1a on the outer periphery of the upper surface of the substrate 1, and a conductor layer 7 formed on the mounting part 1a and electrically connected to the light emitting element 5 through a conductive adhesive material 8. The conductor layer 7 has a protrusion 9 made of an insulator and formed on the periphery. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
