METHOD OF TRANSFERRING CONDUCTIVE PORTION AND METHOD OF MANUFACTURING WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a method of transferring a conductive portion and a method of manufacturing a wiring board which can increase the reliability. SOLUTION: The method of transferring the conductive portion onto a substrate for a product includes a step of (a) forming a first conductive portion on a base electrode of a first substrate for transferring, and (b) metal-bonding the first conductive portion to a second conductive portion formed on the substrate for a product. COPYRIGHT: (C)2005,JPO&NCIPI