发明名称 DIRECT CONTACT POWER TRANSFER PAD AND METHOD OF MAKING SAME
摘要 A power transfer pad, having: a non-conductive board having a top and a bottom; a plurality of conductive substrate sections disposed across the top of the non-conductive board; at least one conducting element disposed on each of the conductive substrate sections; a plurality of electrical contacts on the bottom of the non-conductive board, wherein each of the electrical contacts on the bottom of the non-conductive board are in electrical communication with one of the conductive substrate sections on the top of the non-conductive board.
申请公布号 WO2005060401(A2) 申请公布日期 2005.07.07
申请号 WO2004US30857 申请日期 2004.09.20
申请人 MEDCONX, INC.;KENT, HAROLD, B.;LEVANTE, JAMES, J. 发明人 KENT, HAROLD, B.;LEVANTE, JAMES, J.
分类号 H05K1/11;H05K3/06;H05K3/24;H05K3/28;H05K3/42 主分类号 H05K1/11
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