发明名称 |
METHOD FOR PREPARING POLYMER SURFACES FOR SUBSEQUENT PLATING THEREON, AND IMPROVED METAL-PLATED PLASTIC ARTICLES MADE THEREFROM |
摘要 |
<p>AN IMPROVED METHOD FOR PREPARING POLYMER SURFACES FOR SUBSEQUENT PLATING THEREON, AND IMPROVED METAL-PLATED PLASTIC ARTICLES An improved method for pretreating a polyimide surface in preparation for an adhesion promotion treatment and subsequent metallization is disclosed, wherein the pretreatment comprises mild etching of the surface, contact of the surface with a basic solution, and contact of the surface with a cationic surfactant which is capable of removing a residual film formed on the surface after the mild etching step. This invention further includes articles such as printed circuit boards, which comprise a polyimide substrate pretreated as described above and then treated with an adhesion promoter, wherein an electrolessly-applied metal layer is disposed on the substrate, and an electrolytically-applied metal layer free of chemical additives is disposed on the electrolessly-applied layer. The article may include an additional electrolytically-applied layer containing chemical additives and disposed on top of the first electrolytic layer.</p> |
申请公布号 |
CA1331542(C) |
申请公布日期 |
1994.08.23 |
申请号 |
CA19890600122 |
申请日期 |
1989.05.18 |
申请人 |
GENERAL ELECTRIC COMPANY |
发明人 |
FOUST, DONALD F.;LAMBY, EDWARD J.;KARAS, BRADLEY R.;DUMAS, WILLIAM V.;JERABEK, ELIHU C. |
分类号 |
C23C18/24;C23C18/22;H05K3/18;H05K3/38;(IPC1-7):C23C18/26;H05K1/00 |
主分类号 |
C23C18/24 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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