| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device in which the reduction of a production yield is suppressed with a simplified manufacturing process, to provide an adhesive sheet for use in this method, and to provide the semiconductor device obtained by this method. <P>SOLUTION: This method for manufacturing the semiconductor device comprises the a temporarily securing step of temporarily securing a semiconductor element 13 onto a board or the like 11 by an adhesive sheet 12, and the wire bonding step of performing a wire bonding not through the heating step. A shear adhering force at the temporary securing onto the board or the like 11 of the adhesive sheet 12 is 0.2 MPa or more. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
