CONDUCTIVE FILM FORMATION METHOD AND FORMATION APPARATUS, WIRING BOARD, ELECTROOPTICAL APPARATUS, AND ELECTRONIC APPLIANCE

摘要

PROBLEM TO BE SOLVED: To provide a method of forming a conductive film by lowering the impedance of a conductive film so as to make the film suitable for use for a wiring pattern in simple process. SOLUTION: The conductive film formation method is a method for forming a wiring pattern 48 and comprises a step (a) of arranging a liquid 42 containing conductive fine particles on a substrate W; a step (c) of forming a sintered body (a fine particle bonded body ) 45 of the conductive fine particles by heat treatment of the liquid; and a step (d) of pressurizing the sintered body 45 by a pressurizing roll 40. COPYRIGHT: (C)2005,JPO&NCIPI