| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring substrate that is excellent both in reliability of connection with electronic components mounted on its main surface, and in reliability of connection with other substrates connected on its rear surface. SOLUTION: The wiring substrate, which has a main and a rear surface made of high-polymer materials, is a wiring substrate equipped with main surface connecting terminals for solder-connecting to connection terminals of electronic components to be mounted on the main surface and rear surface connection terminals for mechanically contact-connecting to connection terminals of other substrates connected on the rear surface, and an electroless Ni plating layer and an electroless Au plating layer of a Ni-P group are formed in this order on the surfaces of the main surface connection terminals and the rear surface connection terminals with a thickness of the electroless Au plating layer being more than 0.2μm and less than 0.7μm. COPYRIGHT: (C)2005,JPO&NCIPI
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