发明名称 EPOXY RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To obtain an epoxy resin composition excellent in many of the physical properties and the resistances and in mold releasability on molding. SOLUTION: The epoxy resin composition contains 50-99 wt.% of an aromatic group-containing epoxy resin and 50-1 wt.% of a compound of formula (I). COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005179516(A) 申请公布日期 2005.07.07
申请号 JP20030422749 申请日期 2003.12.19
申请人 ASAHI DENKA KOGYO KK 发明人 OGAWA AKIRA;AOKI EN;AKIMOTO KOJI
分类号 C08G59/04;(IPC1-7):C08G59/04 主分类号 C08G59/04
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