Systems and methods for deformation measurement

摘要

A system for the real-time and in-situ macro and micro measurement of in-plane deformations of a microelectronic package or the like comprises a closed environmental chamber ( 3 ) within which a test sample may be subjected to thermal cycle loading and/or humidity loading, an incoherent white light source ( 6 ) for illuminating the sample, a long-working-distance microscope ( 2 ) and image acquisition means ( 7 ) for capturing speckle patterns from the surface of the sample during loading, and a control ( 8 ) for automating the co-ordination of the various components and for analysing the speckle images using digital image speckle correlation.