发明名称 |
Method for sealing porous materials during chip production and compounds therefor |
摘要 |
A compound and method for sealing or protecting porous materials used in semiconductor fabrication, and in particular for protecting the inner walls of trenches or recesses or vias which are present in such materials. Specifically, compounds and the method of use of the compounds in which polymer compounds comprising functional groups A and B are used to seal surface-exposed pores in porous materials used in chip production.
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申请公布号 |
US2005148202(A1) |
申请公布日期 |
2005.07.07 |
申请号 |
US20040987651 |
申请日期 |
2004.11.12 |
申请人 |
HEILIGER LUDGER;SCHMIDT MICHAEL;TEMPEL GEORG |
发明人 |
HEILIGER LUDGER;SCHMIDT MICHAEL;TEMPEL GEORG |
分类号 |
C09J143/04;H01L21/312;H01L21/768;H01L23/532;(IPC1-7):C09K3/00;H01L21/476 |
主分类号 |
C09J143/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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