| 摘要 |
The invention relates to a novel design of a cooling device for leading dissipated heat away from an electrical or electronic component or from assembly groups to a spatially distant outer cooler, comprising a coolant circuit, which is provided between the component or the assembly group and the outer cooler and which has at least one primary cooler. This primary cooler can be flowed through by the coolant for absorbing the dissipated heat of the component or assembly group. The cooling device also comprises at least one secondary cooler, which can be flowed through by the coolant, and comprises at least one Peltier cooler that is placed in a heat transfer section between the component or the assembly group and the outer cooler. |
